Toshiba Memory Europe GmbH will be exhibiting at Embedded World 2019, where they will highlight the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their cutting-edge 96-layer, BiCS FLASH™ 3D flash memory.
The new UFS flash memory is already sampling and will be available in three capacities: 128GB, 256GB and 512GB. With rapid read/write performance and low power consumption, the new devices are intended for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems. The new devices integrate 96-layer BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard 11.5 x 13mm package. The controller performs error correction, wear leveling, logical-to-physical address translation, and bad-block management for simplified system development.
Supporting the most challenging applications in the automotive sector including infotainment, wireless communication and ADAS, Toshiba will be showcasing extended temperature range embedded NAND memory products that are compliant with JEDEC UFS Ver. 2.1. With five different capacities including 16GB, 32GB, 64GB, 128GB and 256GB, the rugged devices will support a wide variety of automotive applications. The new products meet AEC-Q100 Grade 2 requirements, support the wide temperature range of -40°C to +105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.
96-layer, BiCS FLASH™ 3D flash memory is also at the core of Toshiba’s XG6 series of SSDs – the first drives to use this 3-bit-per-cell (triple-level cell, TLC) technology. The versatile XG6 NVMe SSDs offer capacities up to 1TB with an optimised controller design that delivers greater performance and power efficiency. Targetting client PC, high-performance mobile, embedded, gaming and datacentre applications, The XG6 SSDs the way for these users to upgrade to 96-layer technology. Available in an M.2 2280 single-sided form factor, they support PCI Express® Generation 3×4 lane and NVM Express™ revision 1.3a. Due to their optimised SoCs, the sequential write performance of the XG6 series leads the industry.
Also on show on the booth will be the fourth generation of Toshiba’s BG4 series single package ball grid array (BGA) SSDs. The ultra-compact NVMe™ SSDs include the flash and a brand new controller into a single compact package, bringing flexibility to designers of ultra-thin PC notebooks, embedded systems and server boot systems in data centres. As the densest client SSD by volumetric measurements, the BG4 series offers increased capacity up to 1024GB (1TB), with the 512GB version having a profile of just 1.3mm. The new devices are expected to replace SATA SSDs in notebooks and PCs due to their small size, reduced power consumption and four-fold performance increase.
Visitors to Toshiba’s booth at Embedded World will be able to engage with experts to discuss technical details of the new products.
About Toshiba Memory Europe GmbH
We, Toshiba Memory Europe GmbH, are European business of Toshiba Memory Corporation. Our company offers a broad product line of flash memory products, including SD Cards, USB flash drives, and embedded memory components, in addition to solid state drives (SSD). Our company maintains offices in Germany, France, Spain, Sweden and the United Kingdom. President is Masaru Takeuchi.
For more information on the full range of our memory and SSD products please visit:
https://business.toshiba-memory.com/; www.toshiba-memory.com
