Silicon Labs (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world, is expanding its portfolio of industry-leading RF performance Bluetooth® Low Energy solutions for IoT developers. The company is uniquely positioned to deliver performance, flexibility and package choice for Bluetooth 5.2, including system-on-chip (SoC), system-in-package (SiP), modules and Network Co-Processor (NCP). Silicon Labs IoT solutions feature best-in-class performance and cutting-edge security, and are optimized for power efficiency, cost, size and turnkey simplicity.
Silicon Labs expanded its Bluetooth Low Energy portfolio today with the launch of the BGM220S. At just 6×6 mm, the BGM220S is one of the world’s smallest Bluetooth SiPs. It provides an ultra-compact, low-cost, long battery life SiP module that adds turnkey Bluetooth connectivity to extremely small products. Also launching is the BGM220P, a slightly larger PCB variant optimized for wireless performance along with a better link budget for greater range. BGM220S and BGM220P are among the first Bluetooth modules to support Bluetooth Direction Finding, all while delivering up to ten-year battery life from a single coin cell.
“Our Bluetooth Low Energy product portfolio showcases Silicon Labs’ unique ability to deliver a complete range of wireless solutions with best-in-class performance, power, size and security features,” said Matt Johnson, senior vice president of IoT at Silicon Labs. “Over the years, Silicon Labs has established a proven track record of success across a wide range of IoT wireless areas including Mesh, Multiprotocol, Proprietary, Thread, Zigbee and Z-Wave, to name a few. We are now focusing our wireless expertise to also establish leadership in the Bluetooth Low Energy space and we have seen excellent market reception for our Secure Bluetooth 5.2 SoCs. The BG22, launched in January, is experiencing among the highest levels of product adoption and opportunity pipeline growth we have ever seen, with a wide range of applications in consumer, medical and smart home products.”
