- Qualcomm® Snapdragon™ 820E quad-core processor
- Qualcomm® Adreno™ 530 GPU supporting 4K@60fps, 8 x 1080p@30fps
- Built-in Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 4.1, and GPS
- Compact form factor module with the MXM 3.0 314-pin connector
- VIA Edge AI Developer Kit featuring module, carrier board, and optional 13MP camera
- Android 8.0 BSP; Linux BSP based on Yocto 2.0.3 available in June 2018
VIA SOM-9X20 Module
The highly-integrated VIA SOM-9X20 module is the first product offering from VIA powered by the Qualcomm® Snapdragon™ 820 embedded platform that delivers the ideal balance of leading-edge performance and stunning visual and audio capabilities in a versatile and ultra-compact package for jump-starting the development of next-generation Enterprise IoT and embedded devices.
Hardware
The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm® Snapdragon™ 820E quad-core processor which features the Qualcomm® Adreno™ 530 GPU that is designed to deliver immersive visual graphics. Measuring a mere 8.2cm x 4.5cm, the VIA SOM-9X20 module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, 12C, SPI, and GPIO.
The VIA SOM-9X20 module also provides a full range of wireless connectivity including GPS, BT 4.1, and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors.
Software
The VIA SOM-9X20 BSP features Android 8.0 and Linux Kernel 3.18.44 as well as the VIA Smart ETK (Embedded Tool Kit) comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, RTC for auto-power on, and a sample app. A full set of software customization services that speed up time to market and minimize development costs is also available.
Expandability
To simplify the design, testing, and deployment of intelligent Edge AI systems and devices, the VIA SOM-9X20 is available as part of the VIA Edge AI Developer Kit, which also features a SOMDB2 Carrier Board and optional 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis.
The kit is available in two configurations from the VIA Embedded online store at:
- VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module (COB 1/3.06” 4224×3136 pixels): US$629 plus shipping
- VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board: US$569 plus shipping
- Optional 10.1” MIPI LCD touch panel: US$179 plus shipping.
For more information about the VIA Edge AI Developer Kit, please visit: https://www.viaembeddedstore.com/shop/boards/edge-ai-developer-kit/
For the fastest and most flexible path for accelerating the design and manufacturing of new Edge AI and application-specific IoT systems and devices, you can also take advantage of the VIA Custom IoT Platform Design Service. This delivers a one-stop custom system design solution that covers all steps of the development process, including the definition of the core system specifications, rapid prototyping, hardware and software development, I/O and wireless connectivity integration, and management of the path2production.
For more inspiration on how our VIA SOM-9X20 and VIA Edge AI Developer Kit can be harnessed to create your next Edge AI or Computer Vision system, please download your copy of the VIA Smart Recognition Turnkey System brochure and VIA SOM-9X20 Machine Vision Platform brochure.
