Common thermal management solutions used in electronics applications address cooling objects with fluid flow and heat exchangers. The heat exchanger is typically either the electronic package itself or an extruded or stamped heat sink attached to the package. Air is the most common fluid used in thermal solutions, either propelled by a fan or with natural convection. In most of these solutions the temperature of the object being cooled remains above the ambient temperature. Peltier modules are electronic devices designed for maintaining objects at a specific temperature by controlled heating or cooling objects to below the ambient temperature. Selecting or specifying a Peltier module is not difficult but a basic understanding of module characteristics can be helpful to ensure the process flows smoothly.
To be solved, the Thermal Problem
Many electronic components provide an improved signal to noise ratio at cooler temperatures or are susceptible to damage when operating at temperatures exceeding specifications. Similarly, some chemical reactions must be maintained at or below a specific temperature.
