BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced its participation at SEMICON China 2025, taking place March 26-28, 2025 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China. Visitors are invited to visit booth E7-7201, hosted by BTU representative CohPros International, to learn more about the innovative Pyramax™ TrueFlat™ convection reflow oven, the industry’s leading solution for eliminating substrate warpage in semiconductor packaging applications.
Thermal processing plays a critical role in the formation of interconnects during semiconductor packaging. However, the high temperatures required for reflow can cause significant warpage, particularly in ultra-thin substrates, posing serious challenges to yield and product reliability. BTU’s Pyramax™ TrueFlat™ convection reflow oven is designed to eliminate substrate warpage by applying uniform suction across the entire substrate throughout the heating and cooling process. This groundbreaking technology ensures flat, reliable substrates, even at high throughput, making it the world leader in thin substrate reflow.
In booth E7-7201 customers can learn about a range of award winning reflow technologies from BTU including the modernized Aurora reflow platform, AquaScrub flux management system and Profile Tracer thermal profiling technology which has the capability to assess vibration as well as the thermal performance.
For more information, stop by the BTU booth during SEMICON China 2025 or visit www.btu.com.
