KIC announced that it will exhibit in Hall A4, Booth 506 at Productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The KIC Europe team will discuss Industry 4.0 automation, traceability, NPI setup, machine verification, and more, all for your thermal processes; reflow, wave solder and cure. RPI i4.0. is a simple solution and a great way to start your Industry 4.0 journey, changing heat to data on your reflow oven.
The key is to make sure you have actionable data across the manufacturing line to make well informed decisions. There is data collection on most machines and in addition inspection results possible after printing with SPI, after placement with AOI, and at the end of the line with AOI. But what about reflow?
With RPI i4.0, KIC has introduced the next level of inspection for the reflow process. Knowing that your production reflow temperature profile is inspected and monitored to maintain process control, traceability and quality solder joints for every product run through your oven is a must. This critical data should be a part of your overall Industry 4.0 smart factory solution to ensure all production through the oven is within specifications and that profile data is readily available for each individual board.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight. For more information about KIC, visit www.kicthermal.com.
