More RAM for even more power in high-performance industrial, edge or server applications
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), is now offering COM Express® modules with up to 128 GB non-ECC/ECC DDR4 memory: the COM Express® module COMe-bDV7 with Intel Atom® C3000 processors in Basic Type 7 form factor and the COMe-bCL6 module with the 8th generation Intel® Xeon® E or Intel® Core(TM) processors in Basic Type 6 form factor. Both can optionally be equipped with four memory sockets enabling a maximum memory expansion of 128GB. Kontron customers benefit immediately from the availability of the new 32 GB SO-DIMMs. The new COM Express® modules will be on display at embedded world 2019 (February 26 to 29 in Nuremberg) at Kontron’s booth in Hall 1, 478.
The COMe-bDV7 module is based on processors from the Intel Atom® C3000 product family and offers scalable computing power and network options specifically for use in energy-efficient entry-level server platforms. The COMe-bDV7 module offers server-level computing power with up to 16 processor cores. Up to four 10GbE-KR ports provide the ideal basis for network intensive applications. The KR design allows maximum flexibility in defining the physical interface: KR for backplane connectivity, copper (RJ45), or fiber (SFP+) on the baseboard in conjunction with the appropriate PHY (Physical Layer). In addition, the NC-SI interface enables the connection of a Baseboard Management Controller (BMC) on the baseboard for out-of-band remote management. This improves reliability and also helps to reduce the total operating costs. Now the COMe-bDV7 supports up to 128 GB ECC/non-ECC DDR4 memory. The result is an optimal ratio of multi-core CPU performance to memory size.
The COMe-bCL6 is based on the 8th generation Intel® Core(TM) or Intel® Xeon® E processor family with mobile chipset (CM246/QM370 PCH), which guarantees highest industrial quality and flexible application possibilities. The COM Express® module is available in various processor versions, including six-core processor models. All variants can now be optionally equipped with up to 128 GB non-ECC/ECC DDR4 memory. The COM Express® module supports the Intel® Optane(TM) system accelerator for fast data transfer to and from high-capacity mass storage devices. The optional onboard NVMe SSD also supports the fastest storage technology currently available in a very compact design. Thanks to USB 3.1 support at up to 10Gbps, twice the bandwidth (compared to USB 3.0) can be achieved for fast data transfer. Users of the COMe-bCL6 also benefit from the powerful graphics performance of the 8th processor generation from Intel®. Up to four 4K displays – three of them independent – can be controlled; UHD streaming enables high-quality video applications.
Typical applications include communication, digital signage, professional gaming and entertainment, medical imaging, surveillance and security, as well as industrial plant, machine, and robot control, both at shop floor level and in the control room. In the rugged R E2S version, the COMe-bCL6 meets the specific requirements of the defense and transportation market, thanks to the integrated rapid shutdown function, ECC memory support, and suitability for use in the industrial temperature range from -40°C to +85°C.
Note for media representatives on embedded world 2019 in Nuremberg:
The Kontron press conference will take place on Tuesday, February 26 at 12:00 noon in the NCC OST, Level 1, Hong Kong Room; directly after the main press conference. Please register for the press conference with our agency vibrio at firstname.lastname@example.org
, Tel. 089 32 151 760.
During the fair, media representatives will also have the opportunity for individual meetings at the Kontron booth. Our agency vibrio will be pleased to coordinate an appointment. Please contact our agency vibrio at email@example.com
or call 089 32 151 760.