SEMI, the global industry association representing the electronics design and manufacturing supply chain, announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Designed to stimulate pre-competitive collaboration in order to advance heterogenous integration technology development and accelerate electronics innovation, HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. SEMI is among five HIR sponsors.
SEMI members across the global electronics supply chain integrate separately manufactured components into assemblies to enhance electronics system functionality across a multitude of applications. The heterogeneous integration of wireless and mixed signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into System-in-Package (SiP) architectures for the tremendous array of industries where electronics are used.
The HIR offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of heterogeneous integration technology requirements to spur collaboration over the next 15 years. In addition, the HIR delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research and development timelines.
“The broad industry support for the HIR is a clear mandate for us to stay ahead of the innovation curve and identify barriers that could slow the pace of growth in the electronics industry,” said Ajit Manocha, president and CEO of SEMI. “SEMI is firmly committed to support and connect the HIR with our members worldwide for long-term technology guidance and industry validation. HIR and other collaborations spanning the full supply chain are vital to identifying technology needs and ensuring the microelectronics industry thrives well into the future.”
