PHYTEC Adds Full-featured and Scalable System on Modules

PHYTEC, today announces the phyCORE-i.MX8 System on Module (SOM)phyCORE-i.MX8M SOM and phyCORE-i.MX8X SOM. PHYTEC is a NXP Proven Partner and therefore gets has been granted early access to processors i.MX 8 silicon.

PHYTEC’s SOMs offer the offer next-gen generation technology for industrial industry 4.0 embedded systems: speech recognition and gesture control, connectivity, image processing, machine learning, superior graphics performance as well as sophisticated security features

Highlights of the phyCORE-i.MX8 SOM include:

  • NXP i.MX 8Quad / i.MX 8DualPlus / i.MX 8DualMax application processor
  • ARM Cortex A53/A72/M4F
  • Latest RAM technology with up to 8 GB LPDDR4 RAM
  • 64 – 256 MB Octal SPI/DualSPI Flash
  • 4 GB – 128 GB eMMC
  • 2x Gb Ethernet with AVB
  • Tensilica HiFi 4 – 666 MHz DSP
  • OpenVX support
  • OpenGL ES 3.1 and Vulkan Hardware Acceleration
  • 4k h.265 Decode, 1080p h.264 encode
  • 2x 4-lane MIPI DSI
  • 2x 4-lane MIPI CSI
  • 2x LVDS
  • 73 mm x 45 mm
  • Linux BSP

The phyCORE-i.MX8 SOM is ideal for 3D graphics and multiple displays. The Tensilica HiFi 4 DSP that is and GPU are useful for audio or image effects and processing as well as multiple display and camera interfacesaccelerating machine learning and vision algorithms. This SOM has the most processing power available in i.MX 8 line and features a ruggedized connector interface.

Highlights of the phyCORE-i.MX8M SOM include:

  • NXP i.MX 8M Quad / i.MX 8M Dual / i.MX 8M QuadLite application processor
  • ARM Cortex-A53/M4F
  • Up to 4 GB LPDDR4 RAM
  • Up to 128 GB eMMC (optional up to 1 GB NAND Flash)
  • 2x USB 3.0
  • 2x MIPI CSI
  • WiFi / BLE 4.2 on board (pre-certified with U.FL antenna)
  • Low profile BGA Board to Board connection
  • Tiny 55 mm x 40 mm form factor
  • Linux BSP

The phyCORE-i.MX8M SOM offers WiFi on the SOM as well as 4Kp60 HDR Video Decoding capability. The BGA SOM footprint offers low profile mounting height and saves cost on connectors.

Highlights of the phyCORE-i.MX8X SOM include:

  • NXP i.MX 8QuadXPlus / i.MX 8DualXPlus / i.MX 8DualX application processor
  • ARM Cortex A35/M4F
  • Up to 4 GB LPDDR4 RAM
  • 64 – 256 MB Octal SPI/DualSPI Flash
  • 4 GB – 128 GB eMMC (option: NAND Flash)
  • OpenGL ES 3.1 Hardware Acceleration
  • Tensilica HiFi 4 – 666 MHz DSP
  • 2x LVDS or 2x MIPI DSI, parallel
  • 1x MIPI CSI, 1x parallel
  • Tiny 52 mm x 42 mm form factor

The phyCORE-i.MX8X SOM offers efficient and scalable processing power. In addition, the Tensilica HiFi 4 DSP and GPU are available for additional acceleration and processing power.


Early access program sampling for the phyCORE-i.MX8 and phyCORE-i.MX8M is planned for Q3 2018, with general availability expected in Q4 2018.

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